IBM to Design Self-Destructing Microchips For DARPA

IBMlogo3 EbizIBM will develop microchip technology that is designed to use a self-destruct mechanism under a $3.5 million contract awarded by the Defense Advanced Research Projects Agency.

The company will explore methods for remotely shattering CMOS-based military electronics into powder once the items are discarded, DARPA said Friday in a FedBizOpps notice.

DARPA says IBM intends to use strained glass substrates, an external radio frequency signal and reactive fuse elements to initiate the transient process.

The agency awarded the contract to the company under its Vanishing Programmable Resources program.

email
Filed in: C4ISR, News Tags: , , , , , ,

You might like:

IBM and California Dep’t of Technology present CalCloud platform IBM and California Dep’t of Technology present CalCloud platform
Wyle to Support NASA Ames Research Center Under Potential $270M Contract Wyle to Support NASA Ames Research Center Under Potential $270M Contract
Report: Global Healthcare Analytics Market to Grow 25% by 2019 Report: Global Healthcare Analytics Market to Grow 25% by 2019
NTT DATA to Help NSW Transport Agency Implement SAP ERP Platform NTT DATA to Help NSW Transport Agency Implement SAP ERP Platform

Leave a Reply

Submit Comment

© 0884 ExecutiveBiz. All rights reserved.