Dominique Stump
NextFlex has launched a new technology facility in Silicon Valley with the task to deliver new manufacturing technologies designed to develop and produce flexible hybrid electronics.
The 34,000-square-foot Flexible Hybrid Electronics Manufacturing Innovation Institute will include laboratory space dedicated to flexible hybrid manufacturing and Class 10,000 pilot manufacturing lines, the company said Wednesday.
The Defense Department and FlexTech Alliance started the NextFlex organization to encourage collaborations between companies, academic institutions, nonprofits and government organizations to build FHE manufacturing facilities.
Malcolm Thompson, NextFlex executive director, said the facility will support companies within Silicon Valley and across the country, as well as create a new network fir FHE.
Acting Deputy Assistant Secretary of Defense Andre Gudger, Rep. Anna Eshoo, Rep. Mike Honda, Rep. Zoe Lofgren and San Jose Mayor Sam Liccardo were in attendance for the opening of the facility with Erick Seltmann, manager of advanced electromechanical technologies for Boeing‘s research and technology unit, as a speaker for the event.
Companies, universities and agencies below were among the 40 that showcased their new technology during the event:
- Acellent
- American Semiconductor
- Binghamton University
- Boeing
- Brewer Science
- California Polytechnic State University
- DuPont
- E Ink
- GE Global Research
- HP Enterprise
- i3 Electronics
- Jabil
- NASA
- PARC
- Purdue University
- Uniqarta
- University of Arizona
- University of California, Berkeley
- University of Massachusetts-Amherst
- University of Massachusetts-Lowell
