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IBM and 3M Develop New Adhesives to Create 3D Semiconductors

IBM and 3M Develop New Adhesives to Create 3D Semiconductors - top government contractors - best government contracting event

IBM and 3M Develop New Adhesives to Create 3D Semiconductors - top government contractors - best government contracting eventIBM and 3M today announced their plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” This new class of materials will make it possible to build commercial microprocessors of layers of up to 100 separate chips.

The developments of this effort could lead to dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory creating a computer chip 1,000 times faster than today’s fastest microprocessor.

In order to overcome issues in current 3D chips, new types of adhesive would be needed in order to efficiently conduct heat through the chips and away from heat-sensitive components.

“Today’s chips, including those containing ‘3D’ transistors, are in fact 2D chips that are still very flat structures,” said Bernard Meyerson, VP of Research, IBM. “Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor ““ a silicon ‘skyscraper.’ We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low — key requirements for many manufacturers, especially for makers of tablets and smartphones.”  

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