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Northrop to Present 4 New Microelectronics Tech at DARPA Forum

Northrop to Present 4 New Microelectronics Tech at DARPA Forum - top government contractors - best government contracting event

Northrop Grumman microelectronicsNorthrop Grumman will feature new microelectronics technologies at the Defense Advanced Research Projects Agency‘s “Wait, What?” forum this week in support of the agency’s efforts to facilitate future technology.

The company said Wednesday it will demonstrate four technologies that work toward DARPA’s goal of using innovation to bolster the national security mission.

Northrop highlighted its development of terahertz electronics, in which a microchip operates at 1 trillion cycles per second.

The company noted that it plans to use the chip to deliver high-frequency wireless communications at 850 billion cycles per second.

The technology demonstration also includes communications with a data rate of 100 Gb per second and spectrum usage of 5 GHz; the “ICECool” microfluidic diamond technology that works to cool transistors; and the “DAHI“ 3-D heterogeneous integration of microelectronics.

DARPA’s forum kicked off Wednesday in St. Louis, Missouri, and will continue through Sept. 11.

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