DARPA-GlobalFoundries Team Aims to Address Military EM Spectrum Interference With Semiconductor Chip

DARPAElectroMagneticThe Defense Advanced Research Projects Agency has partnered with semiconductor chip producer GlobalFoundries to develop a silicon-on-insulator chip that works to quickly process radio-frequency signals and prevent interference in congested electromagnetic spectrum.

DARPA and GlobalFoundries developed the 32-nanometer semiconductor-based chip under the Arrays at Commercial Timescales program, the agency said Monday.

The analog-to-digital converter is designed to convert EM spectrum signals into digital format with reduced power requirements.

DARPA said it expects the new chip technology to help military communications tools and other Defense Department systems detect EM spectrum-based threats and operate in contested EM spectrum bands.

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