Mercury Systems has produced custom microelectronics offerings designed to support SWaP-constrained intelligent sensors for defense applications.
Design, assembly and testing took place at the company’s own Phoenix, Ariz. facility accredited by the Defense Microelectronics Activity, Mercury Systems said Tuesday.
The company noted that it produces custom designs for microelectronics supporting the architectures of intelligent sensor systems to mitigate SWaP compromises, thermal management issues and system performace challenges.
The entire product lifecycle was handled at Mercury Systems’ DMEA-accredited location in Arizona in order to avoid supply chain risks associated with offshore production.
“We have made substantial investments in our Phoenix, Ariz. facility to deliver authentic, high-performance devices manufactured using advanced microelectronics technologies,” said Iain Mackie, vice president and general manager of the company's microelectronics secure solutions group.
Mercury Systems used advanced microelectronics manufacturing processes such as radio frequency and mixed-signal integration, 2.5D and 3D packaging, thermal management, scalable production and other cybersecurity and testing processes.