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Draper Awarded DOD Contracts for Computer Chip Packaging Production

Draper
Draper

Charles Stark Draper Laboratory has received $14 million in two awards to produce computer chip packaging for the Department of Defense's military systems.

DOD said Tuesday its Defense Production Act Title III office awarded a $10 million contract to Draper while its Industrial Base Analysis and Sustainment office entered into a $4 million agreement with the company for the effort.

The company will expand its production capacity to deliver microelectronics modules that serve as components of critical defense systems. The U.S. military uses modern microelectronics across multiple types of systems such as ground vehicles and aircraft.

Production of the company's ultra-high-density technology takes place at a Florida-based facility owned by i3 Microsystems.

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Written by Nichols Martin

a staff writer at Executive Mosaic, produces articles on the federal government's technology and business interests. The coverage of these articles include government contracting, cybersecurity, information technology, health care and national security.

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