Jamie Bennet
SkyWater Technology has completed the first phase of a manufacturing capability for silicon bridge interposers with its partner Bridg, a nonprofit developer of microelectronics, and the Interuniversity Microelectronics Centre.
The development initiative is part of the Industrial Base Analysis and Sustainment program funded by the Department of Defense, SkyWater said Thursday.
The new baseline fabrication flow is designed to facilitate advanced packaging of various semiconductor devices into a compact electronic system. Completion of IBAS program Phase I provides the research team with the foundation for incorporating through-silicon vias and radio frequency-enabling materials and devices in the manufacturing process.
“[The new technology] is a major milestone for Bridg and its ecosystem of partners who are establishing capabilities to manufacture domestic, reliable, next-generation microelectronic systems utilizing advanced packaging solutions in an open foundry,” said John Allgair, vice president of advanced systems integration at Bridg.
