June 14th, 2022 9:00am EST Virtual, ON24
Microelectronics – or tiny, complex circuits, machines and components – have been identified as one of the Department of Defense’s critical and emerging technologies that are vital to the United States’ national security. Serving as the “brain” behind electronic systems, microelectronics power commercial and military systems and enable nearly all Defense Department activities, according to Under Secretary of Defense for Research and Engineering, Heidi Shyu.
However, supply chain issues and the decline of microelectronics manufacturing have posed significant challenges for innovation; hampering the research and development of microelectronics could have detrimental impacts on the economic prosperity and technological advantage of the U.S. in the context of global power competition.
Recently, the White House stressed that “a significant interruption to our supply of semiconductors could cause historic damage to the U.S. economy, damage far greater than the impact of chips shortages on the American auto industry right now, and would undercut our technological competitiveness and military advantages over adversaries globally.”
Join ExecutiveBiz Events for the platform’s Microelectronics Forum to hear from federal and industry leaders on the role microelectronics play in the DoD’s National Defense Science and Technology Strategy. Intel will lead a panel discussion around ways to accelerate the development, production and deployment of critical technologies, and how a geographically balanced, resilient supply chain can help address supply chain issues and a hostile geopolitical environment.
Dr. Roy Campbell currently serves as the Chief Strategist for the DoD High Performance Computing Modernization Program (HPCMP) – a $300M per year program chartered by Congress to revolutionize warfighter support through the increased application of HPC to critical research, development, test, and evaluation (RDT&E) initiatives. In this role, he formulates strategic advice, reports, and briefings for the HPCMP Director based on carefully established organizational, financial, technological, geopolitical, scientific, and modernization trends. Dr. Campbell previously served (1) as the HPCMP Chief Scientist, responsible for developing the HPCMP’s science, engineering, and software strategy, (2) as the HPCMP Chief Technology Officer (CTO), responsible for analyzing supercomputing architectures, tracking technical trends, articulating future computational requirements, and procuring supercomputing hardware and software valued at approximately $50M per year, (3) as the HPCMP Deputy Director, responsible for the administration and daily operation of the HPCMP, and (4) as the Program Manager of the Defense Research and Engineering Network (DREN), responsible for (a) the delivery of network and security services valued at approximately $50M per year to over 200 customer sites across 40 states and (b) the leadership of over 140 Government employees and contractors in the innovation and sustainment of the DoD’s premiere research, development, test, and evaluation (RDT&E) network. Dr. Campbell has coauthored 6 journal articles, 30 conference papers, 2 government technical reports, and 3 textbook chapters to date. He was awarded the International Test and Evaluation Association (ITEA) Publications Award in 2011, was a semi-finalist for the Franz Edelman Award for Achievement in Operations Research and Management Sciences in 2009, and was a finalist for the Service to America Award in 2009. He has served on a wide range of evaluation and advisory boards in support of the ACM/IEEE Supercomputing Conference, the Army Research Office, the Australia Department of Defence, the Defense Advanced Research Projects Agency, the Defense Information Systems Agency, the Department of Energy National Nuclear Security Administration, the Department of Energy Office of Science, the Euro-Par Conference, MIT Lincoln Labs, Lawrence Livermore National Laboratory, the National Science Foundation, the National Security Agency, and the Pacific Northwest National Laboratory. To date, he has influenced over $2.75B in Government acquisition.
Greg Clifton is Sales Director – DOD & Intelligence for Intel Corporation. Greg has been working with the DOD and Intelligence Community sectors for the last 20 years to help them identity and understand how Intel based technologies and solutions can enable them to achieve their Mission. Greg collaborates extensively with various Intel Business Units, Technology company partners, and Systems Integrators on a technical and business level to help find and maximize the intersection between the customer’s Mission and Intel’s Technology and Business priorities. Key focus areas include: HPC, Cloud, AI, Edge, Cyber, and Client computing. Greg focuses on customer relationships and results orientation working directly with his Government customers as well the extensive ecosystem of HW, SW, and System Integrator partners that call on the DOD/IC segment. Greg has 25 years of Sales and Business Development experience. He joined Intel in 2000 as part of Intel Online Services and managed the Mid-Atlantic and Greater NY/NJ District. He joined Intel’s Business Development Organization in late 2002. Prior to joining Intel, Greg was a Regional Sales Manager for UUNET Technologies in their Web Hosting Division. Greg is a graduate of Virginia Tech.
Bill Conley is Mercury’s Chief Technology Officer and is responsible for the technical vision and implementation of strategic objectives. He is responsible for aligning technology investments across the company to meet customer needs. Bill has substantial experience in research, development, weapon system acquisition, technology road mapping, strategy development & implementation, and government. Prior to joining Mercury, Dr. Conley was a member of the Federal Senior Executive Service, serving as the Director for Electronic Warfare in the Office of the Secretary of Defense. In that role, he led the $7B annual investment to develop and acquire electronic warfare weapon systems. Earlier in his civilian career, he was a program manager at the Defense Advanced Research Projects Agency, better known as DARPA, where he led an innovative investment portfolio focused on electronic warfare. He started his civilian career as an engineer for the Navy. He is currently Chair of the Sensor Open System ArchitectureTM (SOSA) Consortium Advisory Board, serves on the Board of Directors of the National Defense Industrial Association (NDIA) Central Georgia Chapter, and is a member of the Board of Advisors for Hudson Institute’s Center for Defense Concepts and Technology, a leading global authority on international security issues based in Washington, D.C. Dr. Conley earned a Bachelor of Arts from Whitman College and a Bachelor of Science and Doctor of Philosophy from Purdue University.
Ricardo Gonzalez is the Vice President of Microelectronics at CAES, leading all aspects of product development and production for Space Systems’ Custom and Standard Products business areas. Mr. Gonzalez manages the development of products, solutions, services, customer engagements, and marketing/sales strategies across the Microelectronics portfolio. He is accountable for full Profit and Loss (P&L) across two locations, including Colorado Springs, CO, and in Gothenburg, Sweden. He also serves as the Site Lead for the 500-person Colorado Springs location. CAES is the largest provider of analog and radiation hardened technology for the United States aerospace and defense industry. Mr. Gonzalez is an aerospace and defense executive with over 30 years of demonstrated leadership in business and program management, new business capture, strategy development, and engineering management of large, diverse, and geographically dispersed teams. He has a proven track record of business growth through the development and execution of complex strategies to identify, shape, qualify and capture new business opportunities in military, civilian, and commercial markets. Prior to joining CAES, Mr. Gonzalez was the Director of he Space Systems Product Line within BAE Systems’ Electronic Systems Sector. His organization was headquartered in Manassas, VA and had operations in Merrimack, NH, Reston, VA, Nashua, NH and San Diego, CA. In this role, he developed and manufactured a wide array of space subsystems and components, leveraging world class digital, IR, optical, RF, and ground processing & analytics technologies. The organization supported a broad array of customers, and its products enabled DoD, Civil, Commercial, and National Security Space missions. Mr. Gonzalez received a bachelor’s degree with honors in Electrical Engineering from the University of Puerto Rico and a master’s degree with honors in Electrical Engineering from The Catholic University of America. He is a graduate of the Armed Forces Communications and Electronics Association (AFCEA) Leadership Forum. Mr. Gonzalez is also a graduate of BAE Systems’ Advanced Leaders Program (ALP) and Leadership Enhancement and Accelerated Development (LEAD) Programs. Mr. Gonzalez has received numerous technical, leadership and management awards. He currently serves on the George Mason University ECE Department Advisory Board.
Mr. Brett Hamilton currently serves as the Deputy Principal Director, Microelectronics at OUSD(R&E) MOD. In that capacity he is responsible for programmatic and budgetary oversight of research development, testing, and evaluation (RDT&E) programs and analysis related to microelectronics; integration of activities among DoD, Service laboratories, and fourth estate organizations; development of policy guidance and management oversight for assigned programs; and coordination with industry, universities, and Interagency partners, and other stakeholders. Mr. Hamilton provides technical leadership and policy guidance in assigned areas. Mr. Hamilton represents OUSD(R&E) and its Microelectronics programs, strategy, and priorities to key internal and external stakeholders, including developing, overseeing, and justifying program budgets. In Oct 2017 Mr. Hamilton was promoted to the rank of Senior Scientific Technical Manager (SSTM) and assumed the duties as the DoN's Distinguished Scientist for Trusted Microelectronics. In that role Mr. Hamilton oversaw full spectrum life cycle of scientific and engineering functions in research, design, development, testing, and security evaluation of microelectronics, areas where he holds over 10 patents. He routinely advises senior leadership regarding issues involving microelectronics trust and integrity, including testimony before the House Armed Services Committee on Oversight and Investigations.
Dr. Dev Shenoy joined the Office of the Under Secretary of Defense for Research and Engineering, OUSD(R&E), as the Principal Director for Microelectronics in July 2021. In this role, Dr. Shenoy is responsible for leading the Department of Defense’s research and engineering efforts in Microelectronics. Prior to joining OUSD(R&E), Dr. Shenoy served as the Director of Microelectronics Innovation and as Director of Advanced Technologies at the University of Southern California’s Information Sciences Institute. Prior to joining USC/ISI, Dr. Shenoy served as Chief Engineer in the Advanced Manufacturing Office at the Department of Energy (DOE) HQ. In that role, he co-authored DOE’s 2015 QTR (Quadrennial Technology Review) that served as a blueprint for DOE’s energy technology investments. Among other initiatives, Dr. Shenoy proposed and led a “Big Idea” for U.S. national security and economic competitiveness within the Office of EERE (Energy Efficiency and Renewable Energy) on “Beyond Moore Computing” with participation from eight DOE National Labs. Prior to joining DOE, Dr. Shenoy served as a Senior Advisor at the Manufacturing and Industrial Base Policy (MIBP) Office within the Office of the Secretary of Defense (OSD) as a detailee from the Army Night Vision and Sensors Directorate (NVESD) at Fort Belvoir. In that role, he co-led a Telecom initiative with the White House Office of Science and Technology Policy (OSTP) to explore U.S. opportunities in Optical networks. While at OSD/MIBP, Dr. Shenoy proposed and helped develop a public-private partnership in Photonics that led to the creation of the AIM Photonics Institute. Prior to serving at OSD/MIBP, Dev was a Program Manager at DARPA, (Defense Advanced Research Projects Agency), where he developed and managed cutting-edge technology programs in the areas of Spintronics, such as the STT-RAM (Spin Torque Transfer Random Access Memory) program, a technology that was successfully transitioned and commercialized; Dr. Shenoy also developed and led programs in Photonics and MEMS for defense and commercial applications. Dr. Shenoy has a Ph.D. in Physics from the prestigious Indian Institute of Science in Bangalore, India, and NSF postdoctoral experience from Case Western Reserve University in Cleveland, Ohio.
Dr. Ulrich trained as a physicist at Auburn University receiving his Ph.D. in Condensed Matter Physics in 2001. He came to the Army Research Office in 2003 as the Program Manager for what was then called Condensed Matter Physics and was promoted to the additional role of Chief, Physics Branch, in 2008. He transferred to the role of Electronics Branch Chief in 2020. He is currently serving the Army as the Branch Chief of Advanced Electronics at the DEVCOM Army Research Laboratory, leading a group of researchers innovating reconfigurable neuromorphic architectures, devising novel devices utilizing advanced functional materials and developing methodologies for heterogeneous integration.
9:00am - 9:05am EST
Welcome & Opening Remarks
9:05am - 9:45am EST
Keynote Speaker: Dr. Devanand Shenoy
9:45am - 11:00am EST
Microelectronics Supply Chain of the Future
11:00am - 11:05am EST